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针对3种典型“Smile”形态的半导体激光阵列(LDA)如何装调快轴准直镜的问题,开展“Smile”条件下快轴准直实验定量研究。利用光纤近场扫描法和最小二乘法获得LDA的“Smile”值,采用Zemax非序列模式,模拟“Smile”下LDA的快轴准直。结果表明,LDA的“Smile”大小及形态分布影响准直镜装调位置,透镜光轴需要与LDA匹配,否则会造成光束质量的劣化。这为实际掌握LDA的快轴准直安装提供一种思路,为进一步集成高功率高光束质量的大功率半导体激光器提供了理论和实验基础。
Aiming at the problem that three kinds of typical “Smile” shape semiconductor laser arrays (LDAs) are used to fix the fast axis collimator, a fast axis collimation experiment was carried out under “Smile” condition. The “Smile” value of LDA is obtained by using the fiber near-field scanning method and the least squares method, and the Zemax non-sequential mode is used to simulate the fast axis alignment of LDA under “Smile”. The results show that the “Smile” size and shape distribution of LDA affect the collimation position of the collimating lens. The optical axis of the lens needs to be matched with that of LDA. Otherwise, the beam quality will be deteriorated. This provides a train of thought to master the fast axis collimation of LDA and provides theoretical and experimental basis for further integration of high power and high beam quality high power semiconductor lasers.