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以甲基三甲氧基硅烷和二甲基二甲氧基硅烷为单体,采用硅氧烷水解-缩合法制备了陶瓷电阻封装胶用有机硅树脂;利用红外光谱(FT-IR)法、热失重分析(TGA)法对其结构和热性能进行了分析。研究结果表明:当水解温度为50℃、n(甲基三甲氧基硅烷):n(二甲基二甲氧基硅烷)=1.7:1.0和n(单体)∶n(水)=1.00∶2.63时,有机硅树脂的综合性能相对最佳,并且其具有黏度小、干燥快和耐热性强等优点。
Using methyltrimethoxysilane and dimethyldimethoxysilane as monomers, a silicone resin for ceramic resistor encapsulant was prepared by hydrolysis and condensation of siloxane. The structure of the resin was characterized by Fourier transform infrared spectroscopy (FT-IR) Weight loss analysis (TGA) method for its structure and thermal properties were analyzed. The results show that when the hydrolysis temperature is 50 ℃, n (methyltrimethoxysilane): n (dimethyldimethoxysilane) = 1.7: 1.0 and n (monomer): n 2.63, the overall performance of silicone resin is relatively optimal, and it has the advantages of small viscosity, fast drying and heat resistance.