【摘 要】
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The ever-increasing complexity of on-chip interconnection poses great challenges for the architecture of conventional system-on-chip (SoC) in semiconductor industry.The rapid development of process technology enables the creation of stacked 3-dimensional
【机 构】
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College of Computer Science and Information Engineering, Harbin Normal University, Harbin 150025, Ch
论文部分内容阅读
The ever-increasing complexity of on-chip interconnection poses great challenges for the architecture of conventional system-on-chip (SoC) in semiconductor industry.The rapid development of process technology enables the creation of stacked 3-dimensional (3D) SoC by means of through-silicon-via (TSV).Stacked 3D SoC testing consists of two major issues,test architecture optimization and test scheduling.This paper proposed game theory based optimization of test scheduling and test architecture to achieve win-win result as well as individual rationality for each player in a game.Game theory helps to achieve equilibrium between two correlated sides to find an optimal solution.Experimental results on handcrafted 3D SoCs built from ITC\'2 benchmarks demonstrate that the proposed approach achieves comparable or better test times at negligible computing time.
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