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利用光纤激光加工系统对厚度为0.05mm的薄塑料片进行了打孔试验,分析了激光功率、脉冲宽度、辅助气体压强及种类等工艺参数对薄塑料片小孔群加工质量的影响情况。实验结果表明:小孔孔径随激光功率、激光脉冲宽度、辅助气体压强的增大而增大。相比氮气作为辅助气体,采用氧气作为辅助气体,由于氧气有助燃的作用,孔径明显增大,孔质量变差,热影响区增大。采用优化后的激光加工工艺参数,加工出的小孔群孔径为40±2μm,孔壁光滑,加工质量满足设计要求。
The thin plastic chips with the thickness of 0.05mm were perforated by using the fiber laser processing system. The influence of laser power, pulse width, assisting gas pressure and kinds of process parameters on the processing quality of the thin plastic plate hole group was analyzed. The experimental results show that the aperture of small aperture increases with the increase of laser power, laser pulse width and assisting gas pressure. Compared with nitrogen as an auxiliary gas, oxygen is used as an auxiliary gas. Due to the oxygen-supporting effect, the pore diameter obviously increases, the pore quality deteriorates and the heat-affected zone increases. Optimized laser processing parameters, the processed hole group aperture of 40 ± 2μm, smooth hole wall, processing quality to meet the design requirements.