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对DD3单晶合金进行1250℃保温不同时间的TLP扩散连接研究。降温过程采取了随炉冷却和充氩快冷两种方式,随后对接头进行了870℃/32h/空冷的时效处理。分析了不同规范下的焊缝及母材的组织,同时测定了接头的980℃持久性能。结果发现:炉冷并时效处理试样的焊缝及母材中的γ’相的尺寸随着保温时间增加而增加,且形状趋于不规则。而充氩冷却并时效处理试样的焊缝及母材中的γ’相的尺寸和形状基本一致,随保温时间的增加没有明显变化,立方化较好。低的冷却速率使焊缝和母材中的γ’相粗化从而降低了接头和母材的性能,而高的冷却速率促使焊缝及母材中形成细小立方化的γ’相,不仅使接头性能明显提高,同时母材性能也没有降低。
Study on TLP Diffusion Bonding of DD3 Single Crystal Alloy at 1250 ℃ for Different Time. The cooling process took both the furnace cooling and argon rapid cooling, and then the joint was 870 ℃ / 32h / air-cooling aging. The microstructures of the weld seam and base metal under different specifications were analyzed. The durability of the joint at 980 ℃ was also measured. The results show that the size of γ ’phase in the weld and the base metal of the furnace cold-aged and aged samples increases with the increase of holding time and the shape tends to be irregular. However, the size and shape of the γ ’phase in the weld seam and the base metal of the argon-cooled and aged specimens are basically the same, with no significant change with the increase of the holding time, so the cube is better. The low cooling rate roughens the γ ’phase in the weld and the base metal, which reduces the performance of the joint and the base metal, whereas the high cooling rate causes the formation of a finely cubic γ’ phase in the weld and base metal Joint performance significantly improved, while the base metal performance did not decrease.