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铜合金由于具有优良的导电导热性能，已在现代集成电路塑料封装中占据了引线框架材料８０％的份额。但铜合金容易氧化，其氧化膜被认为是塑料封装再流焊工艺中的分层和裂纹的主要原因之一，因此引线框架铜合金的氧化特性引起了人们的广泛注意。为获得铜合金引线框架良好的可靠性，不少材料工作者对铜合金在塑料封装中的氧化特性及其对铜合金与环氧树脂模压料（ＥＭＣ）的粘接强度的影响进行了研究，为此，本文对引线框架铜合金的氧化物结构及动力学、铜合金与环氧树脂模塑料（ＥＭＣ）粘接强度的影响因素等领域的研究进行了综述。
Due to its excellent electrical and thermal conductivity, copper alloys have occupied 80% of the lead frame material in modern integrated circuit plastic packages. However, copper alloys are easily oxidized, and the oxide film is considered as one of the main reasons for the delamination and cracking in the plastic package reflow soldering process. Therefore, the oxidation characteristics of the lead frame copper alloy have drawn people’s attention. In order to obtain the good reliability of the copper alloy lead frame, many material workers have studied the oxidation characteristics of copper alloy in plastic package and its influence on the bonding strength between copper alloy and epoxy molding compound (EMC) In this paper, the research progress of the oxide structure and kinetics of lead frame copper alloys, the influencing factors of the bonding strength between copper alloys and epoxy molding compounds (EMC) are reviewed in this paper.