大量应用于信息产业的电子基础材料——18微米铜箔,由我国的联合铜箔(惠州)有限公司研制成功,并于最近通过了国家新产品新技术鉴定。这标志着我国在18微米铜箔技术领域达到了国际先进水平,从而打破了日本对这项产品长达30多年的垄断。这项技术的突破,对我国在计算机、航空、航天等高新技术领域的自主开发生产具有重要战略意义。 A large number of electronic basic materials used in the information industry - 18 micron copper foil, developed by China's joint copper foil (Huizhou) Co., Ltd., and recently passed the national new product identification of new technologies. This marked that our country reached the international advanced level in the field of 18-micron copper foil technology, thus breaking Japan's monopoly over this product for more than 30 years. The breakthrough of this technology is of great strategic significance to China's independent development and production in the fields of high-tech industries such as computers, aviation and spaceflight.