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利用热重红外联用和管式炉研究了溴化环氧树脂线路板热处理过程中HBr的析出特性。结果表明:HBr主要在线路板快速失重阶段(300~380℃)析出;加热方式对HBr的析出有很大影响,非等温加热方式下,在380℃以上,反应温度对HBr的析出影响不大。等温加热方式下,反应温度的提高有利于HBr的析出,而且HBr释放量显著高于非等温加热方式;在高温下HBr的析出量随氧分压的增加呈现增大的趋势。
The precipitation characteristics of HBr during the heat treatment of brominated epoxy resin circuit board were studied by TG-IR and tube furnace. The results show that HBr mainly precipitates during rapid weight loss (300 ~ 380 ℃) of the circuit board. The heating mode has a great influence on the precipitation of HBr. Under the non-isothermal heating mode, the reaction temperature has little effect on the precipitation of HBr . Isothermal heating mode, the increase of reaction temperature is conducive to the precipitation of HBr, and HBr release was significantly higher than the non-isothermal heating; at high temperatures, the amount of HBr precipitation increased with the partial pressure of oxygen showed an increasing trend.