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新一代飞机将要求航空电子设备能以更小的体积提供更为优越的系统性能。这一要求导致在各级电子包装上产生高的功率密度。由于没有新的热管理方法，元件结温将显著升高，从而导致可靠性的严重下降，在某些情况下，甚至导致元件功能的失效。为满足改进热管理的要求，已开发出一种液冷方法来代替高功率场合的常规空气冷却法。已经研制出液冷机架和液流通过模块，使结温限制到可以接受的程度。液冷也延长了冷却液损失后应急工作的时间，这对飞行关键设备而言是需要的。目前的活动着重子开发液冷机架和模块，这对综合航空电子系统联合工作组（ＪＩＡＷＧ）管理的国防部（ＤＯＤ）两级维护的创立是个有力的支持。
The new generation of aircraft will require avionics to deliver superior system performance in a smaller volume. This requirement leads to high power density at all levels of electronic packaging. Without a new thermal management method, the junction temperature of the components will increase significantly, leading to a serious degradation of reliability and, in some cases, even failure of the function of the components. In order to meet the requirements of improving thermal management, a liquid-cooling method has been developed to replace the conventional air-cooling method for high-power applications. Liquid-cooled racks and flow-through modules have been developed to limit the junction temperature to an acceptable level. Liquid cooling also extends the emergency work time after loss of coolant, which is needed for flight-critical equipment. The current activity focuses on the development of liquid cooled racks and modules, which is a strong support for the creation of two levels of maintenance at the Department of Defense (DOD) administered by the Integrated Aviation Electronics Systems Joint Working Group (JIAWG).