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采用UG软件构建微孔注塑制品的物理模型,利用Autodesk Moldflow Synergy 2012的填充分析和成型窗口确定最佳的浇口位置和推荐的工艺参数。利用Moldflow的微发泡注塑模块进行填充保压翘曲分析,分析模具温度、熔体温度、注射量、流动速率对泡孔形态和制品翘曲量的影响。结果表明:当采用模具温度为80℃、熔体温度为280℃、注射量为95%和流动速率为65 mL/s进行微孔注塑时,可以得到泡孔小而均匀及翘曲量小的制品。
Use UG software to build a physical model of a micro-hole injection molded product and use Autodesk Moldflow Synergy 2012’s fill analysis and form window to determine the best gate location and recommended process parameters. Moldflow micro-foam injection molding module was used to carry out packing warpage warpage analysis. The effects of mold temperature, melt temperature, injection volume and flow rate on cell morphology and product warpage were analyzed. The results show that when the mold temperature is 80 ℃, the melt temperature is 280 ℃, the injection volume is 95% and the flow rate is 65 mL / s, Products.