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采用双靶磁控溅射沉积Cu-W合金薄膜,通过XRD、TEM和HRTEM等方法分析沉积薄膜组织结构及其演变规律。在沉积初期,Cu-W薄膜呈非晶态,随着沉积过程的进行,在溅射粒子的轰击下已沉积薄膜逐渐晶化并形成类调幅结构,从而在沉积完成的微米级Cu-W薄膜中呈现表层为非晶态、底层为晶态的层状结构。采用Vegard规则对类调幅结构的固溶度进行计算,Cu-13.7%W薄膜是由固溶度分别为11%W和37%W的Cu(W)固溶体及纯Cu相组成;Cu?14.3%W薄膜是由固溶度分别为15%W和38%W的Cu(W)固溶体及纯Cu相组成;Cu-18%W薄膜是由固溶度分别为19%W和36%W的Cu(W)固溶体及纯Cu相组成。
The Cu-W alloy films were deposited by dual target magnetron sputtering. The microstructure and evolution of the deposited films were analyzed by XRD, TEM and HRTEM. In the initial stage of deposition, the Cu-W film is amorphous, and as the deposition process proceeds, the deposited film gradually crystallizes and forms an amplitude-modulated structure under the attack of the sputtered particles, so that the deposited Cu-W film In the surface is amorphous, the bottom of the crystalline layered structure. The Cu-13.7% W thin film is composed of Cu (W) solid solution and pure Cu phase with solid solubility of 11% W and 37% W respectively. The Cu-14.7% W thin film is composed of Cu (W) solid solution and pure Cu phase with solid solubility of 15% W and 38% W respectively; Cu-18% W thin film is composed of Cu with solid solubility of 19% W and 36% (W) solid solution and pure Cu phase.