对电子机器始终提出多功能的要求。随着以半导体器件为代表的各种新的材料和部件的出现,实现了这个要求。现在,更新的电子机器的应用范围正在迅速扩大到手表、电视摄影机、汽车、公害机器等这些新的领域。随之对于电子机器的要求也变得更高。今后的电子机器从以前的量的发展阶段向以功能为主的质的阶段发展,这种演变正在进行着。在这种情况下,电子机器的高密度多功能封装技术的重要性变得日趋 Electronic machines always put forward multi-functional requirements. With the emergence of various new materials and components represented by semiconductor devices, this requirement has been achieved. Now, the application of newer electronic machines is rapidly expanding to new areas such as watches, television cameras, cars, public-hazard machines and more. As the requirements for electronic machines have also become higher. The future of electronic machines from the previous volume of development stage to the function-based quality of the stage, this evolution is under way. Under such circumstances, the importance of high density multi-functional packaging technology of electronic machines has become increasingly important