采用原子镶嵌势函数(EAM)模拟Ni针尖(约1.5nm)/Au基体纳米压痕过程.研究结果表明,当Ni针尖与Au基体间距离达到一定值时(约0.23nm),机械的不稳定性使得针尖与基体间发生跳跃接触,产生纳米压痕和黏附现象(Au原子包裹在Ni针尖周围).当压头离开基体表面,Ni针尖被拔起,随后在针尖与基体间形成连续的由Au组成的细颈.同时计算得到整个系统在针尖接近基体、跳跃接触、压痕、黏附、形成缩颈和一系列分离过程中的势能变化. The atomic indemination potential (EAM) was used to simulate the nanoindentation process of Ni tip (about 1.5 nm) / Au substrate.The results show that when the distance between Ni tip and Au substrate reaches a certain value (about 0.23 nm), the mechanical instability Sex makes the tip and the substrate jump between the contact, resulting in nano-indentation and adhesion phenomenon (Au atoms wrapped around Ni tip.) When the pressure head away from the substrate surface, Ni tip is pulled up, and then in the needle tip and the matrix form a continuous Au. The calculated potential energy of the whole system at the tip of the needle near the substrate, jumping contact, indentation, adhesion, necking and a series of separation processes were calculated.