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引言多年来明显地需要探测迭层结构中是否存在孔洞及未粘合区的可靠方法。全息照相术——记录及稍后在照相底板上再现物体的三维形象的方法——提供了一种引人注意的方法,这种方法解决了与探测迭层结构中是否存在孔洞等有关的长期未予解决的问题。因为用全息照相分析的方法可以容易地观察百分之几时的畸变,当试验部件受应力作用时,表皮下微小缺陷所引起的表面变化变得明显起来。近来已发展了全息照相术在部件检验方面的
Introduction It has been evident for many years that reliable methods of detecting the presence of voids and unbonded areas in laminated structures are clearly needed. Holography - a method of recording and later reproducing a three-dimensional image of an object on a photographic backplane - provides an attractive method of resolving long-term problems associated with the detection of holes and the like in the laminated structure Unresolved issues. Because it is easy to see what percentage of the distortion is caused by holographic analysis, the surface changes caused by subtle sub-epidermal defects become apparent when the test components are stressed. Holographic imaging has recently been developed for component inspection