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建立了异型坯结晶器铜板二维传热模型,应用有限元软件进行求解,分析了不同水缝设计方式下铜板热行为,重点考察了结晶器铜板热面温度峰值和温度均匀性。结果表明:原异型坯结晶器铜板温度峰值为339.6℃,位于R角处,结晶器铜板翼稍两侧均出现温度低谷。增加R角水孔内限流杆直径或将R角限流杆由光滑杆改成螺旋杆均可明显降低铜板温度峰值和温度梯度。此外,在R角增加小孔或将R角小孔改成大孔也可强化R处传热,提高铜板温度均匀性。然而,改善铜板传热效果的最佳办法是重新设计水缝,非均匀分布的等径小孔和非均匀分布的环形水缝加小孔两种水缝设计可有效提高铜板使用寿命、改善铸坯质量,在现场试验效果良好。
A two-dimensional heat transfer model of the mold copper plate was established. The finite element software was used to solve the problem. The thermal behavior of the copper plate under different water-seam design mode was analyzed. The hot surface temperature and the temperature uniformity of the mold copper plate were investigated emphatically. The results show that the peak temperature of original shape blank copper plate is 339.6 ℃, which is located at R angle. Increasing the diameter of the current limiting rod in the R corner water hole or changing the R angle current limiting rod from the smooth rod to the spiral rod can obviously reduce the peak temperature and the temperature gradient of the copper plate. In addition, the increase in the R angle of the hole or R hole into a large hole can also strengthen the R heat transfer, improve the temperature uniformity of copper. However, the best way to improve the heat transfer effect of copper plate is to redesign the water gap, non-uniform distribution of equal-size holes and non-uniform distribution of annular water gap and small holes. Two kinds of water gap design can effectively improve the service life of copper plate and improve the casting Blank quality, the test results in the field good.