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第二节提要本方案(大纲)的目的提供了继续研究、分析,以及用了9个月时间进行的导引头技术的探索研究,这个研究开始于1975年7月25日。本方案(大纲)的第一个任务是碰撞雪崩二极管(IMPATT)发射机的频潜噪声的研究。这个任务是在1975年8月1日到1976年1月1日这个期间内完成的,并包含下列独立的项目: ▲建立试验台,用来测量根据№N00017—74—C—4308合同而研制的碰撞雪崩二极管发射机的调幅和调频噪声特性。▲根据输入激励电平、温度和振动条件,测量三个发射机所有单元的频谱噪声的特性。▲分析被测的频谱噪声分量对主动式脉冲多普勒导引头的影响。本方案的第二个任务是研制X波段相控阵组合件的相互连接技术。这个任务从1975年8月1日到1976年4月19日分五个阶段完成的,并包括下列独立的项目: ▲微波相互连接需要的定义和技术要求: ·电压驻波比。·插入损耗。·功率电平。·容许的相位变化。·对于微波分界面连接的所有可能环境条件的定义。·设计、改进,以及选定的相互连接技术的结构。·研究和确定所需制造最好的相互连接技术的制造技术。·对于最好的相互连接技术,进行产品价值的分析。本方案(大纲)的第三个任务是提供一套所达到的技术指标曲线、重大事件、进度表、途径、方框图和示意图。此任务是在1975年8月1日到1975年9月15日期间完成的,于1975年10月1日提供。本方案(大纲)的第四个任务是准备和提供每两个月一次的技术性的进展报告的三个抄本。三份双月报告是在方案实施过程中准备的,并在1975年10月15日,1975年12月15日和1976年2月10日提供的。
Section II Summary The purpose of this program (outline) provides continuing research, analysis, and exploratory research on Seeker technology that took nine months to complete, and this study began on July 25, 1975. The first task of this program (outline) was to investigate the frequency-hopping noise impacting the IMPATT transmitter. This task was completed between August 1, 1975 and January 1, 1976, and included the following separate projects: ▲ Establishment of a test stand to measure the contract under the № N00017-74-C-4308 contract Amplitude and Frequency Modulation Noise Characteristics of Colliding Avalanche Diode Transmitters. ▲ According to the input excitation level, temperature and vibration conditions, measuring all three transmitter spectral noise characteristics. ▲ Analysis of the measured spectral noise components on the impact of active pulsed Doppler Seeker. The second task of this program is the development of X-band phased array interconnect technology. This task was completed in five phases from August 1, 1975 to April 19, 1976 and included the following separate projects: Definition and technical requirements for the interconnection of microwaves: Voltage standing wave ratio. Insertion loss. ·Power level. Permissible phase change. · Definition of all possible environmental conditions for the microwave interface connection. Design, refine, and structure of the interconnected technologies of choice. · Study and identify the manufacturing technologies needed to create the best interconnect technology. · Analysis of product value for the best interconnect technology. The third task of this program (Outline) is to provide a set of technical specifications achieved, milestones, schedules, avenues, block diagrams, and schematics. This task was completed between August 1, 1975 and September 15, 1975, and was provided on October 1, 1975. The fourth task of the program (outline) is to prepare and provide three transcripts of the technical progress report once every two months. Three bimonthly reports were prepared during the program’s implementation and were provided on 15 October 1975, 15 December 1975 and 10 February 1976.