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High-entropy alloy layer up to 150 lm in thickness was formed on H13 substrate with a metallurgical bonding at the coating/substrate interface. Simple solid solution phases were formed in the coating layer with a typical microstructure composed of both dendrite and interdendrite. The microstructure at the top of the cladding zone consists of equiaxed grains while that at the bottom consists of columnar grains. The coating layer exhibits great enhancement in microhardness and wear resistance compared with the H13 substrate.
High-entropy alloy layer up to 150 lm in thickness was formed on H13 substrate with a metallurgical bonding at the coating / substrate interface. Simple solid solution phases were formed in the coating layer with a typical microstructure composed of both dendrite and interdendrite. The microstructure at the top of the cladding zone consists of equiaxed grains while that at the bottom consists of columnar grains. The coating layer exhibits great enhancement in microhardness and wear resistance compared with the H13 substrate.