论文部分内容阅读
应用处于近红外区域波段的飞秒激光对宽带隙材料SiC的烧蚀机理及其相互作用过程进行了研究。分别采用扫描电子显微镜(SEM)、表面粗糙度轮廓仪(Talysurf)和光学显微镜(OM)等分析技术对烧蚀区和未烧蚀区的表面微观形貌进行了检测和评价。不仅在烧蚀表面观察到了烧蚀区、定向波纹区和改性区等不同形貌特征,而且对加工阶段进行分离,并求出加工SiC时强烧蚀和弱烧蚀的阈值分别为0.13 J/cm2和0.61 J/cm2。根据实验结果得到了加工参数与烧蚀形貌之间的映射关系,发现入射激光的能量是决定材料去除方式的关键参数。
The application of femtosecond laser in the near infrared region to the ablation mechanism and interaction of SiC in wide bandgap materials has been studied. The surface morphology of the ablated area and non-ablated area were detected and evaluated by scanning electron microscopy (SEM), surface roughness profiler (Talysurf) and optical microscope (OM) respectively. Not only ablation zone, directional undulation zone and modified zone were observed on the ablated surface, but also the processing stages were separated and the thresholds of strong ablation and weak ablation were found to be 0.13 J / cm2 and 0.61 J / cm2. According to the experimental results, the mapping relationship between the processing parameters and the ablation morphology is obtained. It is found that the energy of the incident laser is the key parameter that determines the material removal method.