笔者曾多次陈述这么一个观点:有两大轮子同步推动着IC产业链不断地向前发展。一个轮子是不断缩小芯片的特征尺寸,目前已实现65nm芯片的量产,正在向45/32/22nm迈进。另一个轮子是不断地扩大晶圆尺寸,2004年已实现300mm晶圆的量产,目前正在向450mm晶圆过渡。世界赞同450mm晶圆作 I have repeatedly stated such a view: There are two big wheels simultaneously promote the IC industry chain continue to move forward. A wheel is constantly shrinking the size of the chip features, has now achieved 65nm chip production, is moving forward 45/32 / 22nm. Another wheel is to continuously expand the wafer size, mass production of 300mm wafer has been achieved in 2004, is currently transitioning to 450mm wafer. World approves 450mm wafer making