美国Mosaio系统公司最近研究成功一种采用电子可编程序网络代替固定布线方法,在硅衬底上互连芯片的圆片规模集成技术。这项技术可提供较高的封装密度,从而提高航空电子设备的性能,降低生产和设计 A recent study by Mosaio Systems Inc. of the United States of America succeeded in finding a wafer-scale integration technology that uses an electronically programmable network instead of a fixed wiring method to interconnect chips on a silicon substrate. This technology can provide higher packing density, thereby improving the performance of avionics, reduce production and design