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固体界面间的接触导热在许多高技术应用场合具有重要的应用背景。从接触热阻的形成机理出发 ,概述了接触导热机理研究的发展过程 ,论述了应用研究的内容和现状 ,提出了几种增加和减小接触热阻的方法 ,并指出了进一步研究的方向。
Contact thermal conduction between solid interfaces has important application background in many high-tech applications. Based on the formation mechanism of contact thermal resistance, the development of contact thermal conduction mechanism is summarized. The content and current situation of application research are discussed. Several methods to increase and decrease contact thermal resistance are put forward, and the direction of further research is pointed out.