论文部分内容阅读
最近几年LSI、数码相机、移动电话、笔记本电脑等电子产品,不断朝高密度封装与多功能化方向发展,散热问题成为非常棘手的课题。LSI等电子组件若未作妥善的散热处理,不但无法发挥LSI的性能,严重时甚至会造成机器内部的热量暴增等。然而目前不论是LSI组件厂商,或是下游的电子产品系统整合业者,对散热问题大多处于摸索不知所措的状态,有鉴于此,介绍一下国外各大公司散热对策的实际经验,深入探索散热技术今后的发展动向,是很有必要的。
In recent years, LSI, digital cameras, mobile phones, laptops and other electronic products continue to move towards high-density packaging and multi-functional direction, cooling issues become a very difficult issue. LSI and other electronic components without proper heat treatment, not only can not play the LSI’s performance, serious or even cause heat within the machine soaring. However, at present, both the LSI component manufacturers and the downstream electronics system integrators are mostly at a loss to explore the heat dissipation problem. In view of this, we introduce the practical experience of cooling measures of major foreign companies and explore the heat dissipation technology The future development trend is very necessary.