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目前,由于金价飞涨,对用其他键合线材料替代金的关注日益增长。其中,因为铜的成本低、电和机械品质比较好,就成了最常用的替代材料。不过,铜的高硬度是其无法避免的重大问题,它限制了球焊工艺和Cu线的应用。因此,作为Au线的另一个替代选择,研究了Ag线。测试的结果表明,可靠性蜕变是IMC腐蚀引起的,而通过增加Pa的成分能显著地抑制腐蚀。改进的Ag线能通过uHAST48小时和HTS1000小时测试。根据这一研究结果,作为低成本引线,建议用Ag引线替代Cu线用于存储器件中易碎的Al焊盘上。
Currently, concerns over the replacement of gold with other bond wire materials are on the rise because of soaring gold prices. Among them, copper is the most commonly used alternative because of its low cost, good electrical and mechanical qualities. However, the high hardness of copper is its unavoidable major problem, which limits the ball welding process and the application of Cu wire. Therefore, as an alternative to the Au line, the Ag line has been studied. The test results show that the reliability of the transformation is caused by IMC corrosion, and by increasing the composition of Pa can significantly inhibit corrosion. Improved Ag wire passes the uHAST 48 hours and the HTS 1000 hours test. According to the results of this study, as a low-cost lead, it is recommended to use Ag lead instead of Cu wire for brittle Al pads in memory devices.