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论述了印刷电路板(printed circuit board,PCB)用硬质合金微钻材料的发展历程,并重点阐述了微钻材料制备工艺,包括原材料工艺、挤出成型工艺、烧结工艺、热等静压工艺和表面强化工艺的发展状况。提出我国重点在挤压流变学基础理论研究、新成型剂体系开发、成型工艺、设备配套技术和微钻涂层研究方面,应做出更大的努力,从而生产出性能优异、用于高技术产业中的硬质合金微钻材料。
The development of cemented carbide micro-drilling material for printed circuit board (PCB) is discussed. The preparation technology of micro-drilling material is introduced emphatically, including raw material technology, extrusion molding technology, sintering technology, hot isostatic pressing technology And surface hardening process of development. It is proposed that China should make greater efforts in the basic theoretical research of extrusion rheology, development of new molding agent system, molding technology, equipment supporting technology and micro-drill coating research, so as to produce excellent performance for high Carbide Micro-Drill Materials in the Technology Industry.