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以纯铜为研究对象,通过添加铝粉进行不同时间表面机械研磨(SMAT)处理。用金相显微镜、X射线衍射分析仪和扫描电镜对处理后样品的组织结构及成分变化进行分析。采用X射线能量色散谱分析方法(EDS)分析Al元素在不同层的分布与含量。结果纯铜表面出现了明显的分层现象,同时铜铝发生互扩散,有铜铝合金形成。处理时间为120 min与处理时间为240 min合金层的厚度均约为35μm,并且合金层与基体变形层结合紧密。由于弹丸的冲击产生应力应变和大量储存能,使得原子的跳动频率增加,同时降低了扩散激活能,实现铜铝在较低温度下快速互扩散。
Taking pure copper as the research object, different mechanical surface grinding (SMAT) treatments were carried out by adding aluminum powder. The microstructure, composition and composition of the treated samples were analyzed by metallographic microscope, X-ray diffraction analyzer and scanning electron microscope. The distribution and content of Al in different layers were analyzed by energy dispersive X-ray spectrometry (EDS). Results Pure copper surface appeared obvious delamination phenomenon, at the same time copper and aluminum mutual diffusion occurs, the formation of copper and aluminum alloy. The treatment time of 120 min and the treatment time of 240 min are about 35 μm, and the alloy layer and the base deformable layer are tightly bonded. As the projectile impact stress and strain and a large number of stored energy, making the atomic bounce frequency increases, while reducing the diffusion activation energy, to achieve rapid copper-aluminum interoperability at lower temperatures interdiffusion.