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薄膜表面和界面应力的测量是近年来的热点课题,原则上,薄膜与体材的应力分析方法并无差别,可以通过X射线衍射进行测量。本文以有关薄膜和表面区X射线应力分析的专题评述为蓝本,解读有关依赖于试样和测量条件的分析方法和测量策略。为此,将推荐若干实用的测试方法:对于无织构和宏观弹性各向同性薄膜试样,可采用掠入射多衍射线的薄膜应力分析方法,在这种情况下,当用小入射角时,常规的sin2ψ法可以使用;对于(hhh)和(h00)的应变测量,具有准各向同性的优点,可以直接采用sin2ψ法;对于有织构试样,材料呈宏观弹性各向异性,可采用晶体群方法。这些方法对于薄膜、多层膜、硬质涂层或体材近表面区的应力分析,具有十分重要的理论价值和使用意义,也可用于新型电子薄膜材料等的应力分析,为其性能改善和控制提供理论依据。
Measurement of surface and interface stress of thin films is a hot issue in recent years. In principle, there is no difference between stress analysis methods of thin films and bulk materials, and it can be measured by X-ray diffraction. In this paper, the thematic review of X-ray stress analysis of thin films and surface areas is modeled on the interpretation of analytical methods and measurement strategies that depend on the sample and measurement conditions. To this end, a number of practical test methods will be recommended: For non-textured and macroscopically elastically isotropic thin film samples, a thin film stress analysis method using grazing incidence multiple diffraction lines may be employed, in which case when using a small angle of incidence , The conventional sin2 ψ method can be used; for the (hhh) and (h00) of the strain measurement, with the advantages of quasi-isotropy, can be directly used sin2 ψ method; for textured samples, the material was macroscopically elastic anisotropy, Crystal group method. These methods have very important theoretical value and significance for stress analysis of films, multilayer films, hard coatings or near-surface areas of bulk materials. They can also be used for stress analysis of novel electronic thin film materials and the like, Control provides a theoretical basis.