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针对航空发动机、重型燃气轮机等动力设备燃烧室内压力原位测量的需求,设计了一种基于4H-SiC的LC谐振式无线高温压力敏感芯片.以现有SiC微工艺水平为基础,利用TCAD软件及多物理场耦合仿真软件,完成了敏感芯片电容、电感、感压膜等主要部件的结构设计、优化,以提高敏感芯片的Q值及耦合强度.探讨了电感内置、外置两种设计方案本体电容的大小,并在此基础上提出一种双腔体结构,将本体电容值减小到179.66 p F.优化后的敏感芯片常温(20℃)Q值约为13.66,100 k Pa满量谐振频率变化158.62 k Hz;1 000℃下的Q值为3.65,满量变化55.53 k Hz,且1 000℃下的热应力较小.这种敏感芯片将可应用于高温压力传感器的制备,为我国自主研制航空发动机、高超发动机、重型燃气轮机等先进动力系统提供支撑.
In order to meet the demand of in-situ pressure measurement in combustion chamber of aerodynamic equipment such as aero-engines and heavy-duty gas turbines, a 4H-SiC based LC resonant wireless high temperature pressure sensitive chip was designed.According to the existing SiC micro-process level, Multi-physics coupled simulation software to complete the structure design and optimization of the main components of the sensitive chip capacitors, inductors, pressure-sensitive films, etc. In order to improve the Q value and the coupling strength of the sensitive chip, two design schemes of inductor internal and external are discussed Capacitor size, and based on this proposed a dual-cavity structure, the body capacitance is reduced to 179.66 p F. The optimized sensitivity of the chip at room temperature (20 ℃) Q value of about 13.66,100 kPa full-scale resonance The frequency variation is 158.62 k Hz, the Q value at 1 000 ℃ is 3.65, the full-scale variation is 55.53 k Hz, and the thermal stress is small at 1 000 ℃ .This sensitive chip can be applied to the preparation of high-temperature pressure sensor, Independent research and development of aero engines, superb engines, heavy gas turbines and other advanced power systems to provide support.