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分析置换镀铜的电化学沉积机理，研制出提高铜层结合强度的专用添加剂和防锈钝化剂，能有效地增加镀层致密度和抗锈蚀性能。
Analyze the electrochemical deposition mechanism of displacement copper plating, and develop special additives and rust-preventive passivation agent to improve the bonding strength of copper layer, which can effectively increase the density and corrosion resistance of the coating.