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研究了在大块非晶合金切削力信号检测时利用独立分量分析法对检测信号进行去噪处理技术。在试验中，采用独立分量分析法对切削测量系统测量的大块非晶合金切削力信号进行迭代分离，从而提取出主切削力信号。并针对大块非晶合金在不同切削深度下的变形特征，运用扫瞄式电子显微镜观察了大块非晶合金的切削带特征。主切削力信号频谱的快速傅里叶变换分析表明，随着切削深度的增加，切削力信号高频部分的振幅越来越大，而大块非晶合金切削力信号高频部分是由切削带形成过程的特征引起的，并随着切削深度的增加而增加，且主切削力Fz 的频率为115 Hz。研究结果表明：采用独立分量分析法进行噪声分离后更能精确识别切削力信号中的主要信息，减少噪声造成的误判。“,”The deformation behavior of BMG machining in difference cutting depth were investigated using SEM and cutting force measurement system. Then new fracture and shear band information extraction method based on independent component analysis( ICA)and fast Fourier transform( FFT)were used to analyze the original force signals. The main cutting force signals were extracted from the original signals by ICA method. The energy spec-trum of those main signals is processed by FFT. The analysis results show that the high frequency contents of cut-ting force increasing with the cutting depth. The fracture and shear band generation behavior in BMG chip result in strong high frequency cutting force signals and the high frequency contents of cutting force increasing with the cutting depth. Besides,the frequency of Fz is 115 Hz and its amplitude also increases with the increasing of depth.