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引线键合机是半导体组装工序中的典型设备。在过去十多年里,由于接受了高速化、省力化和小型化等许多要求,并采用了微型计算机和图象识别等最新技术,确实在发展和改造方面成绩显著。 作为其技术进步的结果,提高了集成电路的生产效率,实现了组装过程的省力化,减少了建造代价昂贵的净化厂房面积。因而
Wire bonding machines are typical devices in semiconductor assembly processes. In the past decade or so, due to many demands such as speeding up, labor-saving and miniaturization, and the use of the latest technologies such as microcomputers and image recognition, there have been notable achievements in development and transformation. As a result of its technological advancement, the production efficiency of the integrated circuit is improved, the labor-saving of the assembly process is realized, and the area of the decontamination plant which is expensive to construct is reduced. thus