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采用试验方法研究了基板配置方式及上板厚度对三层板压印接头力学性能的影响。对上层板厚度不同以及配置形式不同的6组试件进行拉伸剪切试验,结果表明:接头配置形式对失效模式以及强度有很大影响。6种接头中,C型配置方式接头的拉伸强度最大;同种配置方式下,上板厚度对接头强度影响很大,上板厚度越大接头拉伸强度越大,其中A型配置方式中表现最明显。接头失效模式有颈部断裂失效、内锁拉脱失效和混合失效。不同的失效模式对应不同的失效位移,颈部断裂失效位移最小,混合失效位移其次,内锁拉脱失效位移最大。
The influence of substrate arrangement and thickness of the upper plate on the mechanical properties of the three-layer board imprinting joint was studied by the test method. Tensile shear tests were performed on six specimens with different thickness and configuration of the upper deck. The results showed that the joint configuration had a great effect on failure mode and strength. Of the 6 kinds of joints, the tensile strength of the C type configuration joint is the largest. Under the same configuration, the thickness of the upper plate has a great influence on the strength of the joint, and the greater the thickness of the upper joint, the greater the tensile strength of the joint, The most obvious performance. Failure modes of the joint have failure of neck fracture, failure of internal locking pull-off and mixing failure. Different failure modes correspond to different failure displacements, with the least failure displacement of the neck fracture, followed by the mixed failure displacement and the largest displacement of the internal locking failure.