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以聚酰胺酸(PAA)为基体,通过正硅酸乙酯(TEOS)和异丙醇铝的水解缩合反应制得硅氧铝溶胶;然后采用加热聚合法将硅氧铝溶胶和PAA聚合,制备出纳米杂化PI(聚酰亚胺)薄膜。着重探讨了无机纳米粒子中n(Al)∶n(Si)比例对不同纳米杂化PI薄膜的结构、微观形貌、热稳定性、电击穿性能和耐电晕性能等影响。研究结果表明:当w(总纳米粒子)=12%(相对于PI质量而言)、n(Al)∶n(Si)=1∶4时,纳米杂化PI薄膜的综合性能相对较好,此时其热稳定性和电绝缘性能优异。
Polyacetal acid (PAA) was used as matrix to prepare silica alumina sol through hydrolysis and condensation reaction of TEOS and aluminum isopropoxide. Then, silica alumina sol and PAA were polymerized by heating polymerization to prepare Nanopharm hybrid PI (polyimide) film. The effects of n (Al): n (Si) ratio on the structure, microstructure, thermal stability, electrical breakdown and corona resistance of nano-hybrid PI films were investigated. The results show that when n (Al): n (Si) = 1: 4 for w (total nanoparticles) = 12% (relative to the PI mass), the overall performance of the nanohybrid PI film is relatively good, In this case, it has excellent thermal and electrical insulating properties.