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2014年6月3日讯:飞思卡尔半导体日前推出专为坚固耐用型应用而设计的首款塑封器件,继续保持在射频功率技术领域的长期领导地位。新款MR-FE6VP5150N/GN和MRFE6VP5300N/GN功率放大器是业界首个驻波比大于65∶1的额定器件,采用模塑封装。飞思卡尔高级副总裁兼射频部总经理Paul Hart表示:“飞思卡尔已为蜂窝市场的宏蜂窝基站部署了数百万的塑封射频功率晶体管。我们正将我们的射频功率放大器封装专长扩展到工业应用中。我们的塑封产品组合具有最佳耐
June 3, 2014: Freescale Semiconductor continues to deliver long-term leadership in RF power technology with the first plastic encapsulant designed for ruggedized applications. The new MR-FE6VP5150N / GN and MRFE6VP5300N / GN power amplifiers are the industry’s first rated devices with a VSWR of greater than 65: 1 in a molded package. Paul Hart, Freescale’s senior vice president and general manager of RF Division, said: ”Freescale has deployed millions of plastic RF power transistors for cellular macro cells and we are expanding our RF power amplifier package expertise To industrial applications, our plastic package has the best resistance