论文部分内容阅读
精磨玻璃表面的破坏层由凹凸层和裂纹层组成。凹凸层和裂纹层的空间特性,直接影响其后的抛光效率。测量破坏层深度,为选用适当的方法精磨和抛光,使加工工艺最优化,提供了依据。测量精磨玻璃表面破坏层深度可以用光束扫描探测法,也可以用抛光测试法和电子显微镜观测法等。光束扫描探测法适用于实验室,抛光测试法适用于车间,而电子显微镜法仅适用于科研单位和高等院校。
The sabotage layer on the ground glass surface consists of a concavo-convex layer and a crack layer. The spatial characteristics of the asperity layer and the crack layer directly affect the subsequent polishing efficiency. Measuring the depth of destructive layer, for the selection of the appropriate method of grinding and polishing, the processing technology to optimize, provide a basis. Measuring the depth of damaged glass surface layer can be used to scan the beam scanning method, you can also use the polished test method and the electron microscope observation method. Beam scanning detection method for the laboratory, polishing test for the workshop, and electron microscopy is only applicable to research institutes and institutions of higher learning.