论文部分内容阅读
一,表面组装(SMT)与再流钎焊(Reflow Soldering) 随着大规模(LSI)和超大规模(VLSI)集成电路技术的发展,越来越高的小型化和可靠性要求,电子组装技术已从真空管连线组装,晶体管分立元件印刷板组装,双列直插元件(DIP)印制板组装发展到表面组装(SMT)。SMT可包括印制板表面组装和各种薄膜,厚膜混合电路组装。 SMT是一种新的组装概念。它把各种有引线和无引线元件组装到印制板的一个或两个表面上,而代替过去使用的有引线元件通孔插件组装(在一面组装而在另一面焊接)。这种新的组装概
I. Surface Mount (SMT) and Reflow Soldering With the development of large scale (LSI) and very large scale (VLSI) integrated circuit technology, the increasing miniaturization and reliability requirements, the electronic assembly technology From vacuum tube connection assembly, the transistor discrete components printed board assembly, dual in-line component (DIP) printed circuit board assembly developed to surface mount (SMT). SMT can include printed board surface assembly and a variety of thin film, thick film hybrid circuit assembly. SMT is a new assembly concept. Instead of the conventional leaded component through-hole insert assembly assembled on one side and welded on the other side, it has assembled various leaded and leadless components on one or both surfaces of a printed board. This new assembly outline