1.前言低温半导体温度传感器已经沿用十多年了。虽然人们在发展新传感器及减少它们的尺寸方面已作了相当大的努力,但制作最小尺寸的传感器似乎受到实际温度检测元件封装大小的限制。为了满足工业上的技术要求(例如易于操作、易于检定和长期稳定性),商品温度传感器的封装似乎又是必需的。因此,设计小型的低温传感器已是各个研究小组的任务了。 1. Introduction Cryogenic semiconductor temperature sensors have been used for more than a decade. While considerable efforts have been made to develop new sensors and reduce their size, making the smallest size sensor appears to be limited by the size of the actual temperature sensing element package. In order to meet industrial technical requirements such as ease of handling, ease of verification, and long term stability, the packaging of commodity temperature sensors seems necessary. Therefore, the design of small cryogenic sensors has been the task of various research groups.