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采用电子背散射衍射技术对比研究了经大变形冷拔后的连续纤维晶纯铜线材860℃×30 s高温短时退火与400℃×1 h低温长时退火其微观组织、织构和晶界特征分布以及力学性能和导电性能的变化规律。结果表明:经860℃退火30 s后铜样品基本完成再结晶,其晶粒平均直径为20μm与400℃×1 h退火结果 25μm相差不大,且两者的织构均为较明显的<100>丝织构;860℃退火30 s后其重合位置点阵(Coincidence Site Lattice,CSL)晶界量可达51%明显高于400℃退火处理结果 35%。高温退火后的抗拉强度和导电率与低温大致相当,高温退火和低温退火后铜线的导电率均达到较高水平分别为103.29%IACS和101.50%IACS。因此,连续纤维晶纯铜线材经860℃高温短时退火后获得的力学性能和导电性能不低于低温退火。
The electron backscatter diffraction technique was used to study the microstructure, grain structure and grain boundaries of the continuous fiber pure copper wire subjected to large deformation and cold drawing at 860 ℃ × 30 s for short annealing and 400 ℃ × 1 h for low temperature annealing Feature distribution and mechanical and electrical properties of the law of change. The results showed that the copper samples recrystallized after annealed at 860 ℃ for 30 s, and the average grain size of 20 μm was almost the same as that of the annealed samples at 400 ℃ for 1 h and 25 μm, respectively > Silk texture. After annealing at 860 ℃ for 30 s, the grain boundary of Coincidence Site Lattice (CSL) reached 51%, which was significantly higher than that of annealing at 400 ℃ for 35 s. After high temperature annealing, the tensile strength and electrical conductivity are approximately the same as those of low temperature, and the electrical conductivity of copper wire after high temperature annealing and low temperature annealing reach the higher levels of 103.29% IACS and 101.50% IACS, respectively. Therefore, the continuous fiber crystal pure copper wire after 860 ℃ high temperature short-time annealing obtained mechanical properties and electrical conductivity of not less than low-temperature annealing.