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利用双面氧化弯曲方法原位测量了Fe－23Cr－5Al合全空气中氧化形成的Al2O3膜平均生长应力Al2O3膜内存在压应力，900℃下氧化20h，膜内应力从3．5降低到2GPa；1000℃下氧化10h，膜内应力从0．8降低到0．4GPa．合金表面离子注入1×1017Ce+／cm2，增大了Al2O3膜的生长应力，其原因是添加稀土促进膜的横向生长，离子注入Ce同时增大了合金的氧化速率，促进了Al2O3膜的起皱，膜发生起皱后，其实际长度比平整的膜要大，由基体合金蠕变而引起的膜内应力释放也较少，尽管膜隆起部分与基材剥离，但膜整本与合金仍保持好的粘附性，在冷却过程中膜剥落量较少
The average growth stress of Al 2 O 3 film formed by oxidation of Fe-23Cr-5Al in the air was measured by double-sided oxidation bending method in-situ compressive stress and oxidation at 900 ℃ for 20h. The in-plane stress decreased from 3.5 to 2GPa ; Oxidation at 1000 ℃ for 10h, the stress in the film decreased from 0.8 to 0.4GPa. The reason is that the addition of rare earth can promote the lateral growth of the film, ion implantation of Ce increases the oxidation rate of the alloy at the same time, promotes the wrinkling of the Al2O3 film, After wrinkling, the actual length of the film is larger than that of the flat film, and the release of stress in the film caused by the creep of the matrix alloy is also less. Although the film uplift part is peeled off from the substrate, the entire film and the alloy are still good Of the adhesion, the film peeling in the cooling process less