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微机械电子系统中的铜薄膜分布很广,为了改进微机械电子系统的构件性能、延长使用寿命,提出一种激光冲击铜薄膜的能量衰减数学模型分析新方法。所提方法通过改进Kanai模型给出激光冲击铜薄膜的能量衰减数学模型,使用两步回归处理方法确定模型回归系数,保证模型回归精度。在模型的基础上,以激光入射周期为横坐标、多种类构件面积归一化结果为纵坐标,绘制铜薄膜吸收能量衰减和铜薄膜滞回能量衰减影响曲线图,根据曲线分析出构件面积、激光强化因子和激光入射距离对铜薄膜能量衰减的影响规律。实验结果说明,所提新方法的模型回归精度高,分析结果更加可靠。
In order to improve the component performance and prolong the service life of MEMS, a new method for the mathematical model analysis of energy attenuation of laser impinging on copper thin film is proposed. The proposed method gives the mathematical model of energy attenuation of laser shocked copper thin film through the improved Kanai model, and uses the two-step regression method to determine the model regression coefficient to ensure the regression accuracy of the model. On the basis of the model, taking the laser incident period as the abscissa and the normalized results of various kinds of component areas as the ordinate, the absorption energy attenuation of the copper thin film and the attenuation effect of the hysteresis energy of the copper thin film are plotted, and the component area is analyzed according to the curve, Influence of Laser Enhancement Factor and Laser Distance on the Energy Decay of Copper Thin Films. The experimental results show that the proposed method has high regression accuracy and the results are more reliable.