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选取NHZP-1型双马树脂拉挤Z-pin,并结合差示扫描量热法(DSC)测定及工艺参数优化来调控其固化度,将Z-pin按70°角(Z-pin植入方向与水平方向夹角)植入Rohacell-51WF泡沫、采用5429/HT7双马单向预浸料作为蒙皮,成功制备K-cor夹层结构,并展开了相应的力学性能测试。根据Z-pin在K-cor与X-cor夹层中与蒙皮结合方式差异建立微观拉伸结构简图,并借助欧拉杆屈曲模型来估算其临界失稳载荷,定性分析了平面压缩过程中Z-pin的破坏模式与增强机制。结果表明:Z-pin固化度为62.74%时,K-cor夹层结构的平面拉伸强度和模量分别为1.55MPa与88.56MPa,平面压缩强度和模量高达3.61MPa与128.84MPa,均比空白泡沫试样和具有相同Z-pin参数的X-cor夹层结构有所提高。
The Z-pin of NHZP-1 bismaleimide resin was selected and its curing degree was controlled by the combination of differential scanning calorimetry (DSC) and optimization of process parameters. The Z-pin was implanted at a 70 ° angle Direction and horizontal direction) was implanted Rohacell-51WF foam, 5429 / HT7 double unidirectional prepreg as a skin, the successful preparation of K-cor sandwich structure, and started the corresponding mechanical properties test. According to the difference of Z-pin bonding mode between the K-cor and X-cor interlayers, the microstructure of the microstructure was established and the critical buckling load was estimated by the Euler rod buckling model. The Z -pin destruction mode and enhanced mechanism. The results show that the tensile strength and modulus of K-cor sandwich structure are 1.55MPa and 88.56MPa respectively when the curing degree of Z-pin is 62.74%, the compressive strength and modulus of plane are as high as 3.61MPa and 128.84MPa, The foam samples and the X-cor sandwich with the same Z-pin parameters improve.