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为获得先进陶瓷材料的高效、高精度加工,通过采用新研制的半固着磨具来实现一种半固着磨粒加工技术.制作了以SiC为磨料的不同粒度和磨料浓度的半固着磨具(SFAT),讨论分析了磨料粒度和磨料浓度对半固着磨具特性(剪切强度和表面硬度等)的影响.采用所制作的半固着磨具加工单晶硅片,研究半固着磨具的磨耗率和工件材料去除率.初步实验结果表明,磨料粒度#1000和磨料质量分数为65%的半固着磨具的磨具磨耗率最小且工件材料去除率最大.实验结果有助于指导半固着磨具制作.
In order to obtain high-efficiency and high-precision machining of advanced ceramic materials, a semi-fixed abrasive processing technology was achieved by adopting a newly developed semi-fixed abrasive, and a semi-fixed abrasive with different particle sizes and abrasive concentrations with SiC as an abrasive SFAT) was used to discuss the effect of abrasive particle size and abrasive concentration on the properties of semi-fixed abrasive (such as shear strength and surface hardness) .The single-crystal silicon wafer was fabricated by semi- Rate and workpiece material removal.The preliminary experimental results show that the abrasive wear rate of the semi-fixed abrasive with the abrasive particle size of 1000 and the abrasive mass fraction of 65% is the smallest and the material removal rate of the workpiece is the largest.The experimental results are helpful to guide the semi- With production.