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光亮镀锡铅合金正在广泛地用于印制线路板的制造工艺中,作为图象法的保护层。线路板腐蚀完后,插头部份的锡铅合金必须退除,以便镀硬金。以往采用盐酸水溶液电解法退除锡铅合金镀层,费电费时而且退除不均,铜层表面往往残存有锡铅。为了退除这些残存的锡铅镀层需要延常退镀时间,但时间过长,铜基体受到破坏变成麻坑。镀金后影响接插的电性能。另外,也试用过三氯化铁退除法,但效果更差,退除严重不均,甚至将铜基体破坏。所以一般的含酸退镀液时间长,不易保证退镀质量。基于上述原因,我们试验了一种化学腐蚀液快速退除锡铅层的方法;这种退镀液和以前的相比较,有下列优点:操作简单,退除速度快、均匀、对玻璃钢
Bright tinned lead alloys are being used extensively in the manufacturing of printed circuit boards as a protective coating for image processes. After etching the circuit board, the plug part of the tin-lead alloy must be removed in order to hard gold. In the past, the use of hydrochloric acid aqueous solution of tin-lead alloy plating to remove the coating, the cost of electricity and eliminate uneven and uneven, the surface of the copper often tin-lead remain. In order to get rid of these remaining tin-lead plating, it is necessary to extend the normal plating time, but it takes too long to destroy the copper matrix and become a pit. Gilding affect the electrical properties of the patch. In addition, ferric chloride removal test was also tried, but the effect is worse, the serious unevenness is removed, and even the copper matrix is destroyed. Therefore, the general acid bath with a long time, not easy to guarantee the quality of plating. Based on the above reasons, we tested a rapid chemical and chemical etching solution to remove the tin-lead layer; this solution compared with the previous, has the following advantages: simple operation, the removal of fast, uniform, FRP