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对激光技术广泛使用的磷酸二氢钾(KDP)和磷酸二氘钾(DKDP)电光晶体另件加工的基本要求是获得的抛光表面缺陷要最少。根据对晶体损伤提出的热电子机理得出,为了提高表面的抗光强度首先要改善加工,即在保持表面光学质量条件下尽可能完全消除由于机械加工而引起的损伤裂纹层。根据文献[2]数据,KDP晶体经极粗的机械加工(切割)后,其〔001〕面方向损伤层深度不大于145微米。关于DKDP晶体的类似数据文献中未见到。作者研究了KDP和DKDP晶体用不同粒度金刚砂粉研磨后的凸凹和裂纹层,并讨论
The basic requirement for processing of electro-optical crystals of potassium dihydrogen phosphate (KDP) and potassium di-deutero-phosphate (DKDP) which are widely used in laser technology is to obtain the least amount of polishing surface defects. According to the thermionic mechanism proposed for crystal damage, it is found that in order to improve the light intensity of the surface, the processing needs to be improved firstly, that is to say as far as possible to completely eliminate the damaged crack layer caused by machining while maintaining the surface optical quality. According to the literature [2], the depth of damaged layer in the direction of [001] plane of KDP crystal is not greater than 145μm after the extremely coarse machining (cutting). Similar data on DKDP crystals is not seen in the literature. The authors studied the convexo-concave and cracked layers after grinding KDP and DKDP crystals with different particle sizes of emery powder and discussed