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研究了无铅钎料Sn-3.8Ag-0.5Cu与Cu焊盘接头Cu-Sn界面金属间化合物的形成与长大机理。采用CALPHAD方法利用ThermoCalc软件进行了Sn-3.8Ag-0.5Cu/Cu合金体系亚稳相图计算,比较了界面处局部平衡时各相形成驱动力大小,预测了体系界面反应过程中的金属间化合物形成类型和反应通道;预测结果表明,界面金属间化合物有Cu6Sn5、Cu3Sn,第一析出相为Cu6Sn5;通过SEM和EDX分析,验证了预测的准确性。根据金属学固液界面的扩散与溶解规律,分析了界面金属间化合物的形成和长大特点。
The formation and growth mechanism of Cu-Sn interface intermetallics between lead-free solder Sn-3.8Ag-0.5Cu and Cu pad was investigated. The CALPHAD method was used to calculate the metastable phase diagram of Sn-3.8Ag-0.5Cu / Cu alloy system by using ThermoCalc software. The driving forces of each phase in local equilibrium at interface were compared and the intermetallic compounds Formation type and reaction channel. The prediction results show that the interface intermetallics include Cu6Sn5 and Cu3Sn, and the first precipitates are Cu6Sn5. The accuracy of the prediction is verified by SEM and EDX analysis. According to the diffusion and dissolution rules of the solid-liquid interface, the formation and growth characteristics of interface intermetallics were analyzed.