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研究了二步法浸蚀 YG1 5硬质合金基体表面预处理的过程 ,并在浸蚀过的硬质合金基体上 ,用热丝法沉积了金刚石薄膜。结果表明 ,二步浸蚀法可在基体表面深度为 6～ 1 2 μm的范围内 ,使 Co含量从 1 5 %降低到 0 .85 %～ 5 .42 % ,并使硬质合金基体的表面粗糙度增加到 Ra=1 .0μm,但会导致硬质合金基体表面的硬度从 HRA85 .5降低至 HRA83.3;在该硬质合金基体沉积金刚石薄膜之后 ,发现样品的金刚石薄膜组织结构具有 {1 1 0 }和 {1 1 1 }面混合取向 ,金刚石涂层与硬质合金基体具有较高的粘结强度。
The surface pretreatment of the YG1 5 cemented carbide substrate by two-step etching was studied. On the etched cemented carbide substrate, a diamond film was deposited by the hot wire method. The results show that the two-step etching method can reduce the Co content from 15% to 0 .85% -5.42% in the range of 6 ~ 12 μm in substrate surface depth and make the surface of the cemented carbide substrate The roughness increased to Ra = 1.0μm, but the hardness of the cemented carbide substrate decreased from HRA85.5 to HRA83.3. After the cemented carbide substrate was deposited, the diamond film structure of the sample was found to have { 1 1 0} and {1 1 1} planes, the diamond coating and the cemented carbide substrate have higher bonding strength.