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采用电化学方法以及扫描电子显微镜、X-射线电子能谱表面分析技术,研究铜币在模拟汗液中的腐蚀行为。结果表明,模拟汗液中的氯离子能加剧黄铜的阳极活性溶解反应,是发生孔蚀和脱锌腐蚀的主要原因,氨水和乳酸的存在对其阳极反应过程有一定促进作用,而尿素的存在对腐蚀过程影响不大。黄铜表面形成的腐蚀产物主要由氯化铜、氧化亚铜、尿素与铜形成的配合物以及少量的乳酸离子组成。黄铜在模拟汗液中蚀孔发展的动力学过程遵循方程J0=0.3735(t+185.93)-1/2,该过程受孔表面盐膜溶解控制。
Electrochemical methods, as well as scanning electron microscopy and X-ray photoelectron spectroscopy, were used to study the corrosion behavior of copper in simulated sweat. The results show that chloride ions in simulated sweat aggravate the anodic active dissolution reaction of brass, which is the main reason of pitting corrosion and dezincification corrosion. The existence of ammonia and lactic acid can promote the anode reaction process, while the presence of urea Little effect on the corrosion process. The corrosion products formed on the brass surface are mainly composed of cupric chloride, cuprous oxide, complexes of urea with copper, and small amounts of lactic acid ions. The kinetics of the growth of pits in simulated sweat follows the equation J0 = 0.3735 (t + 185.93) -1/2, which is controlled by the salt film dissolution at the pore surface.