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采用Cu箔作中间层 ,在温度为 85 3K的条件下进行了SiCP/Al复合材料的瞬间液相 (TransientLiquid -Phasebonding ,TLP)连接 ,用扫描电镜观察了连接界面微观形貌 ,测定了接头的剪切强度 ,着重研究了连接时间和压力对界面结构和强度的影响。研究表明 ,不加压连接时 ,由于在界面处形成纯金属带 ,且氧化膜也难以去除 ,接头强度较低 ,约为母材强度的 48% ,接头剪切强度随连接时间延长而增高。连接时施加 0 .2MPa的压力即可显著提高接头强度 ,达到母材强度的 70 % ,且强度随连接时间变化不大。试验还发现 ,用Cu箔中间层无压瞬间液相连接小增强相颗粒、高体积百分含量的SiCp/AlMMCs时 ,接头界面区域没有发现颗粒偏聚 ,本文对此进行了理论分析
The Cu foil was used as the intermediate layer, and the transient liquid phase (TLP) connection of the SiCP / Al composite was carried out at a temperature of 85 3K. The microstructure of the interface was observed by scanning electron microscopy. Shear strength, focusing on the connection time and pressure on the interface structure and strength. The results show that when no pressure is applied, the pure metal strip is formed at the interface and the oxide film is hard to be removed. The joint strength is low, which is about 48% of the strength of the base metal. The shear strength of the joint increases with the prolongation of the connection time. When applying pressure of 0.2 MPa, the joint strength can be significantly increased to 70% of the base metal strength, and the intensity changes little with the connection time. It is also found that no segregation of particles is observed in the interface area of the joint with small reinforcing phase particles and high volume percentages of SiCp / AlMMCs by the unpressurized transient liquid phase connection of the Cu foil intermediate layer. In this paper, theoretical analysis