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对于移动电话、薄笔记本个人计算机和数字视频摄像机等设备来说,为使其体积微型化、重量轻型化和功能多样化,当前的解决办法,主要是依靠以芯片规模封装(CSP)为代表的先进封装技术的进展,而开发积层多层印制电路板技术将使这种高密度封装成为可能。但是,开发这种积层多层印制电路板需要高密度互连材料技术,以及精细间距电路形成技术和微导通孔形成技术的支持。从贮藏环境意识的观点看,在该领域中引入环境技术也是必要的。本文将介绍基于环境考虑而开发的不含卤/锑的高密度互连材料。
For devices such as mobile phones, thin notebook personal computers and digital video cameras, current solutions are mainly relying on chip scale packaging (CSP) for their miniaturization, weight reduction and versatility. Advanced packaging technology advances, and the development of multilayer multilayer printed circuit board technology will enable this high-density packaging possible. However, the development of such multilayer multilayer printed circuit boards requires high-density interconnect material technology, as well as fine-pitch circuit formation technology and micro-via formation support. From the viewpoint of storage environment awareness, it is also necessary to introduce environmental technology in this field. This article describes high-density, halogen-free / antimony-based interconnects that have been developed based on environmental considerations.