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磁控溅射镀膜设备可以广泛用于镀膜Ｔｉ－Ｎ膜．从实用观点看，磁控溅射工艺中的溅射速率和溅射原子空间分布是被广泛关心的．沉积在试样表面的溅射原子被认为除了与等离子体的参数有关，还与靶──工件的几何分布有关系．本文研究了真空室中Ｔｉ－Ｎ膜沉积的空间分布．在研究中十分值得注意的是溅射量与沉积量作为两个不同的概念严格区分．
Magnetron sputtering coating equipment can be widely used in coating Ti-N film. From a practical point of view, the sputter rate and spatter space distribution in a magnetron sputtering process are of wide concern. The sputtered atoms deposited on the surface of the sample are considered to be related to the plasma parameters as well as the geometrical distribution of the target. This paper studies the spatial distribution of Ti-N film deposition in a vacuum chamber. It is very noteworthy in the study that the amount of sputter and deposit are strictly distinguished as two different concepts.