采用直流磁控溅射的方法 ,在 Si(111)基片上沉积 Al N(10 0 )面择优取向薄膜 ,研究了溅射功率对 Al N薄膜结构及表面粗糙度的影响。结果表明 ,随着溅射功率的增加 ,沉积速率增大 ,但薄膜结构择优取向度变差 ,表面粗糙度增大 ,这说明要制备择优取向良好、表面粗糙度小的 Al N薄膜 ,需选择较小的溅射功率。 The Al N (100) oriented films were deposited on Si (111) substrates by direct current magnetron sputtering. The effect of sputtering power on the structure and surface roughness of AlN thin films was investigated. The results show that with the increase of sputtering power, the deposition rate increases, but the preferred orientation of the film structure deteriorates and the surface roughness increases. This shows that to prepare Al N thin films with good orientation and small surface roughness, Smaller sputtering power.